Sijesyon pou rezoud echèk limyè lari ki ap dirije
To solve these existing problems, it is recommended that street lamp manufacturers start from basic materials and solve the problem of high-power LED heat sources from the inside out. For example, thermal adhesive plays a key role in the bonding of light-emitting components and aluminum substrates. Some manufacturers think that the thermal conductivity of thermally conductive adhesive films or thermally conductive adhesive pads is better, and the thicker the film thickness, the better, but they do not think about thermal resistance. No matter how good the thermal conductivity is, the thermal resistance of the film thickness is useless. What's more, the thermally conductive adhesive film or soft thermally conductive gasket cannot really adhere to the substrate, and there are actually many pores on the bonding surface. These pores look like hollow air pockets under an electron microscope, another form of thermal resistance. In the presence of so many thermal resistances that interfere with heat conduction, the efficiency of heat dissipation and heat conduction is virtually reduced.
Sèvi ak adezif kondiktif tèmik dwat la, rekòmande adezif mou seramik tèmik kondiktif la. Adezif mou seramik tèmik kondiktif la pou konstriksyon enprime ekran diferan de fim adezif tradisyonèl lyezon tèmik kondiktif la. Adezif mou seramik kondiktif tèmik la se mou ak semi-likid. Lè lam machin enprime ekran an aplike sou substra aliminyòm lan, patikil kondiktif tèmik yo pral antre nan porositë yo sou sifas substra a. dwe ranpli a plen. Nan fason sa a, yo pral fòme yon avyon konplètman plat san porositë, ki pral konplètman respekte substra epitaxial ki ap dirije a. Nan fason sa a, rezistans tèmik la redwi a yon minimòm, ak chalè a ka byen vit soti, ki natirèlman diminye tanperati anbyen nan mouri a ki ap dirije, pwolonje lavi a nan epitaksi a ak anpil reta ensidan an nan pouri limyè. Anplis de sa, akòz duktilite nan penti mou seramik tèmik kondiktif aplike pa enprime ekran, pandan gwo tanperati boulanjri oswa reflow, li pral chanje ak ekspansyon nan tèmik ak kontraksyon nan substra aliminyòm lan. Estrès la piti anpil, epi substra aliminyòm lan pa pral defòme, se pou kont li pral eksploze.
Nan pwoteksyon ekstèn nan lanp dirije, li rekòmande yo sèvi ak mou seramik chalè dissipation penti pou lanp dirije. Sa a espre -kalite mou chalè seramik-dissipation penti a ka dirèkteman flite sou eksteryè a nan lanp dirije, ak konstriksyon fasil ak operasyon, epi yo ka adapte nan divès fòm chalè -dissipation. estrikti, epi yo ka ajiste tou nan diferan koulè pou satisfè bezwen yo nan konsepsyon jaden flè. Patikil mou seramik ki nan penti abazde chalè espre-tip -dissipe yo nano-trete. Patikil yo amann yo pa sèlman fasil yo opere zam nan espre, men tou, fè patikil yo tèmik kondiktif sou menm zòn nan kouch pi dans ak dans, se konsa ke zòn nan kote tanperati a volatilize ak difize se tou pi gwo. Se pou enèji chalè lanp ki ap dirije yo byen vit soti. Seramik mou chalè -dissipation penti a se yon materyèl thermosetting, ki konfòme ak pwoteksyon anviwònman RoHS ak estanda sekirite yo. Pwosedi konstriksyon an se senp epi li pa mande pou nenpòt ekipman espesyal. Apre boulanjri, chalè -geri epi li ka kenbe tèt ak tanperati ki wo nan LED la pou yon tan long san okenn chanjman kalitatif. Dirije limyè lari yo, limyè jaden flè, oswa tablo afichaj ki ap dirije yo itilize deyò ap fè fas tou domaj asid ak alkali soti nan van ak lapli, jete zwazo lapli asid, pousyè lè, emisyon lafimen nwa, elatriye Se poutèt sa, sa a espre -tip mou. seramik chalè dissipation penti dwe gen karakteristik sa yo nan asid ak rezistans alkali. Ranje aktyèl la rezistans asid ak alkali se PH311, ki ka efektivman pwoteje aparans nan lanp ki ap dirije deyò soti nan yo te erode.
The cost structure of LED lamps and lanterns has been improved with the improvement of packaging technology, carrier board design, and heat dissipation module structure, and the quality has been continuously improved, and the cost has also decreased with the development of technology and market demand. However, there are not many manufacturers investing in material improvement, which is mainly related to the history and habits of Taiwan's industrial and commercial development. Taiwanese manufacturers are good at manufacturing process and design, and they pay less attention to the basic research and development of materials. Therefore, when it comes to solving technical problems or reducing costs, it is more inclined to purchase thinking or production management thinking. However, American and Japanese manufacturers will think from the perspective of applied materials, reduce costs, improve quality and increase profits from the perspective of innovation.
