Poukisa lanp dirije yo pi gwo pase lanp tradisyonèl yo?
Mainly because of LED cooling technology. Heat dissipation is a major factor affecting the lighting intensity of LED lamps. The heat sink can solve the heat dissipation problem of low illumination LED lamps. A heat sink cannot solve the heat dissipation problem of 75W or 100W LED lamps. To achieve the desired lighting intensity, active cooling techniques must be used to account for the heat released by the LED luminaire components. Some active cooling solutions such as fans do not last as long as LED fixtures. In order to provide a practical active cooling solution for high-brightness LED luminaires, the cooling technology must be low energy consumption; suitable for small luminaires; and have a lifespan similar to or longer than the light source.
Anjeneral pale, radyatè yo ka divize an refwadisman aktif ak refwadisman pasif dapre fason pou retire chalè nan radyatè a.
Passive heat dissipation means that the heat of the heat source LED light source is naturally dissipated into the air through the heat sink. The heat dissipation effect is proportional to the size of the heat sink, but because it dissipates heat naturally, the effect is of course greatly reduced. It is often used in those who do not require space. For example, some popular motherboards also use passive heat dissipation on the north bridge, and most of them use active heat dissipation. Active heat dissipation is forced through cooling devices such as fans. The heat emitted by the heat sink is taken away, which is characterized by high heat dissipation efficiency and small size of the device.
Refwadisman aktif ka divize an refwadisman lè, refwadisman likid, refwadisman tiyo chalè, refwadisman semi-conducteurs, refwadisman chimik ak sou sa. Lè -lè refwadi-dissipasyon chalè refwadi se metòd dissipation chalè ki pi komen, epi li se tou yon metòd pi bon mache an konparezon. Refwadisman lè se esansyèlman itilize yon fanatik pou retire chalè radyatè a absòbe. Li gen avantaj ki genyen nan pri relativman ba ak enstalasyon pratik. Sepandan, li trè depann sou anviwònman an. Pou egzanp, lè tanperati a monte ak overclocking, pèfòmans refwadisman li yo pral afekte anpil.
Kounye a, dissipation chalè nan lanp dirije sitou gen ladan metòd sa yo:
1. Refwadisman likid
Likid -dissipation chalè ki refwadi se sikilasyon fòse likid pou retire chalè radyatè a anba kondwi ponp lan. Konpare ak lè-refwadi, li gen avantaj ki genyen nan silans, refwadisman ki estab, ak mwens depandans sou anviwònman an. Pri a nan refwadisman likid se relativman wo, ak enstalasyon an se relativman anbarasman. An menm tan an, eseye enstale selon metòd ki enstwi nan manyèl la pou jwenn pi bon efè dissipation chalè. Pou rezon pri ak fasilite pou itilize, likid -disipasyon chalè ki refwadi anjeneral itilize dlo kòm likid transfè chalè a, kidonk radyatè likid-refwadi yo souvan refere yo kòm radyatè ki refwadi dlo-.
2. Tiyo chalè
Tiyo chalè fè pati yon kalite eleman transfè chalè. Li fè tout itilizasyon prensip kondiksyon chalè ak pwopriyete transfè chalè rapid nan medyòm refrijerasyon. Li transfere chalè atravè evaporasyon ak kondansasyon likid nan tib vakyòm ki konplètman fèmen. Li gen trè wo konduktiviti tèmik ak bon pèfòmans izotèmik. Zòn transfè chalè sou tou de bò kote frèt ak cho yo ka chanje abitrèman, transfè chalè long-, kontwòl tanperati ak yon seri avantaj, ak echanjeur chalè ki konpoze de tiyo chalè gen avantaj ki genyen nan chalè segondè. efikasite transfere, estrikti kontra enfòmèl ant, pèt rezistans likid ki ba, elatriye avantaj. Konduktivite tèmik li depase byen lwen nenpòt metal li te ye.
3. Semiconductor refrijerasyon
Semiconductor refrijerasyon se sèvi ak yon fèy frijidè semiconductor espesyal pou jenere yon diferans tanperati lè li kouran pou refwadi. Osi lontan ke chalè a nan bò tanperati ki wo ka efektivman gaye, bò tanperati ki ba a se kontinyèlman refwadi. Yon diferans tanperati pwodwi sou chak patikil semi-conducteurs, ak yon fèy frijidè konpoze de plizyè douzèn patikil sa yo nan seri, kidonk fòme yon diferans tanperati ant de sifas yo nan fèy frijidè a. Sèvi ak fenomèn diferans tanperati sa a, ak refwadisman lè / refwadisman dlo pou refwadi fen tanperati ki wo, yo ka jwenn yon efè ekselan chalè dissipation. Semiconductor refrijerasyon gen avantaj ki genyen nan tanperati frijidè ki ba ak segondè fyab. Tanperati a nan sifas frèt la ka rive anba mwens 10 degre, men pri a twò wo, epi li ka lakòz yon kous kout akòz tanperati ki twò ba, ak teknoloji aktyèl la nan frijidè semi-conducteurs se frelikè ak ensifizan. pratik.
4. Frijidè chimik
The so-called chemical refrigeration is to use some ultra-low temperature chemicals, and use them to absorb a lot of heat when they melt to reduce the temperature. The use of dry ice and liquid nitrogen is more common in this regard. For example, the use of dry ice can reduce the temperature to below -20 degree , and some more 'perverted' players use liquid nitrogen to reduce the CPU temperature to below -100 degree (theoretically), of course, due to the high price and too short duration, this The method is more common in the laboratory or extreme overclocking enthusiasts.
Choice of heat dissipation material. Generally speaking, ordinary air-cooled radiators naturally choose metal as the material of the radiator. For the selected material, it is hoped that it has both high specific heat and high thermal conductivity. Silver and copper are the best thermally conductive materials, followed by gold and aluminum. But gold and silver are too expensive, so at present, heat sinks are mainly made of aluminum and copper. In comparison, both copper and aluminum alloys have their own advantages and disadvantages: copper has good thermal conductivity, but it is expensive, difficult to process, heavy, and the heat capacity of copper radiators is small, and it is easy to oxidize. . On the other hand, pure aluminum is too soft to be used directly. Only aluminum alloys are used to provide sufficient hardness. The advantages of aluminum alloys are low price and light weight, but the thermal conductivity is much worse than that of copper. Therefore, in the development history of radiators, the following materials have also appeared:
1. Pi bon kalite koule chalè aliminyòm
Pi bon kalite radyatè aliminyòm se radyatè ki pi komen nan premye jou yo. Pwosesis fabrikasyon li yo senp epi pri a ba. Jiskaprezan, pi bon kalite radyatè aliminyòm toujou okipe yon pati konsiderab nan mache a. Yo nan lòd yo ogmante zòn nan dissipation chalè nan najwar li yo, metòd pwosesis ki pi souvan itilize pou radyatè aliminyòm pi se teknoloji extrusion aliminyòm, ak endikatè prensipal yo pou evalye yon radyatè aliminyòm pi se epesè baz radyatè a ak PIN {{0 }}Fin rapò. PIN refere a wotè nan najwar yo nan koule chalè a, ak Fin refere a distans ki genyen ant de najwar adjasan. Rapò Pin-Fin se wotè Pin an (eksepte epesè baz la) divize pa Fin la. Pi gwo rapò Pin-Fin, se pi gwo zòn efikas chalè dissipation radyatè a, ak teknoloji extrusion aliminyòm pi avanse.
2. Pi bon kalite kwiv chalè koule
The thermal conductivity of copper is 1.69 times that of aluminum, so other things being equal, a pure copper heat sink can take heat away from the heat source faster. However, the texture of copper is a problem. Many advertised 'pure copper radiators' are not really 100 percent copper. In the list of copper, copper with a copper content of more than 99 percent is called acid-free copper, and the next grade of copper is Dan copper with a copper content of less than 85 percent . Most of the pure copper heat sinks on the market currently have a copper content between the two. The copper content of some inferior pure copper radiators is not even 85 percent . Although the cost is very low, its thermal conductivity is greatly reduced, which affects the heat dissipation. In addition, copper also has obvious shortcomings, such as high cost, difficult processing, and too much mass of the heat sink, which hinder the application of all-copper heat sinks. The hardness of red copper is not as good as that of aluminum alloy AL6063, and the performance of some mechanical processing (such as grooving) is not as good as that of aluminum; the melting point of copper is much higher than that of aluminum, which is not conducive to extrusion and other problems.
3. Copper-aliminyòm Liaison teknoloji
Apre yo fin konsidere enpèfeksyon yo nan kòb kwiv mete ak aliminyòm, kèk radyatè segondè -nan mache a souvan itilize pwosesis manifakti konbinezon kwiv-aliminyòm. Lavabo chalè sa yo anjeneral sèvi ak baz metal kwiv, pandan y ap najwar koule chalè yo te fè nan alyaj aliminyòm. Natirèlman, Anplis de baz kwiv la, gen tou metòd tankou itilize nan poto kòb kwiv mete pou koule chalè a, ki se tou prensip la menm. Avèk konduktiviti tèmik segondè, sifas anba kwiv la ka byen vit absòbe chalè a lage pa CPU a; najwar yo aliminyòm ka fè nan fòm ki pi favorab pou dissipation chalè avèk èd nan pwosesis konplèks vle di, epi bay yon espas depo chalè gwo epi lage li byen vit. Yo te jwenn yon balans nan tout aspè.
Yo nan lòd yo amelyore efikasite nan lumineux ak lavi sèvis nan dirije, rezoud pwoblèm nan nan chalè dissipation nan pwodwi ki ap dirije se youn nan pwoblèm ki pi enpòtan nan etap sa a. Se poutèt sa, itilizasyon lithografi limyè jòn pou fè mens -fim seramik chalè-disipasyon substrats yo pral vin youn nan katalis enpòtan yo ankouraje amelyorasyon kontinyèl nan dirije nan gwo pouvwa.
